CR2032R-HO6 - Murata Electronics

CR2032R-HO6 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the CR2032R-HO6?
  The recommended land pattern for the CR2032R-HO6 is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
• How do I handle the CR2032R-HO6 during reflow soldering?
  During reflow soldering, the CR2032R-HO6 should be placed on the PCB with the component side facing upwards. The recommended reflow profile is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 220°C.
• What is the maximum operating temperature range for the CR2032R-HO6?
  The maximum operating temperature range for the CR2032R-HO6 is -40°C to 85°C. However, the component can withstand storage temperatures up to 125°C for short periods of time.
• How do I ensure the CR2032R-HO6 is properly connected to the PCB?
  To ensure proper connection, the CR2032R-HO6 should be placed on the PCB with the anode (positive leg) facing upwards and the cathode (negative leg) facing downwards. The component should be centered on the PCB and the leads should be bent at a 90-degree angle to ensure good contact with the PCB pads.
• What is the recommended cleaning process for the CR2032R-HO6?
  The CR2032R-HO6 should be cleaned with a mild detergent and deionized water. Ultrasonic cleaning is not recommended, as it may damage the component. Avoid using harsh chemicals, abrasive materials, or high-pressure cleaning methods.