CR2032W-HO6 - Murata Electronics

CR2032W-HO6 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the CR2032W-HO6?
  The recommended land pattern for the CR2032W-HO6 is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
• How do I handle the CR2032W-HO6 during reflow soldering?
  During reflow soldering, the CR2032W-HO6 should be placed on the PCB with the component side facing upwards. The recommended reflow profile is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C.
• What is the maximum operating temperature range for the CR2032W-HO6?
  The maximum operating temperature range for the CR2032W-HO6 is -40°C to 85°C. However, the component can withstand storage temperatures from -40°C to 125°C.
• How do I ensure the CR2032W-HO6 is properly connected to the PCB?
  To ensure proper connection, the CR2032W-HO6 should be placed on the PCB with the component side facing upwards. The component should be centered on the land pattern, and the solder joints should be inspected for quality and integrity.
• What is the recommended storage condition for the CR2032W-HO6?
  The recommended storage condition for the CR2032W-HO6 is in a dry, cool place, away from direct sunlight and moisture. The component should be stored in its original packaging or in a sealed bag to prevent moisture absorption.