The recommended land pattern for CR2512-FX-1272ELF is a rectangular pad with a size of 2.5 mm x 1.2 mm, with a 0.5 mm x 0.5 mm thermal pad in the center. The pad should be 0.05 mm thick and have a solder mask defined gap of 0.1 mm.
Yes, CR2512-FX-1272ELF is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the application meets the recommended operating conditions.
Handle CR2512-FX-1272ELF by the edges or the body, avoiding touching the terminations or the component's surface. Use ESD-safe materials and tools during assembly and rework to prevent damage from electrostatic discharge.
The recommended soldering profile for CR2512-FX-1272ELF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
CR2512-FX-1272ELF is not designed for use in humid or wet environments. It's essential to ensure that the component is properly sealed or protected from moisture to prevent corrosion or electrical failures.
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CR2512-FX-1272ELF Overview
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