The thermal resistance of the CRCW12061R37FNEA is 350°C/W, which means it can dissipate heat efficiently and maintain its performance even in high-temperature applications.
Yes, the CRCW12061R37FNEA is suitable for high-frequency applications due to its thin-film construction and low inductance, which minimizes parasitic effects and ensures stable performance up to several hundred MHz.
Yes, the CRCW12061R37FNEA is designed to withstand high-vibration environments due to its rugged construction and secure terminations, which ensure reliable performance even in harsh mechanical conditions.
Yes, the CRCW12061R37FNEA is compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant and environmentally friendly designs.
The recommended land pattern for the CRCW12061R37FNEA is a rectangular pad with a minimum size of 1.5 mm x 0.8 mm, with a non-solder-mask-defined (NSMD) pad shape to ensure reliable soldering and minimize thermal stress.
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CRCW12061R37FNEA Overview
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