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CRGCQ0603F270K - TE Connectivity

Description: SMD AEC-Q200 Compliant Thick Film Chip Resistor,

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CRGCQ0603F270K - TE Connectivity - PCB symbol
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PCB Footprints
CRGCQ0603F270K - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - 1.6mm x 0.8mm_2026-1.1
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CRGCQ0603F270K - TE Connectivity - 3D model - Resistor Chip - 1.6mm x 0.8mm_2026-1.1
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CRGCQ0603F270K Details

  • Manufacturer Part Number:

    CRGCQ0603F270K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    13

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Physical Dimension:

    1.6mm x .8mm x .45mm

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    270000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

CRGCQ0603F270K Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRQ0603F270K is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component centerline, with a gap of 0.1mm between the pad and the solder mask.
  • The maximum operating temperature range for CRQ0603F270K is -55°C to +125°C, with a derated temperature range of -55°C to +150°C for a limited time (e.g. during reflow soldering).
  • Yes, CRQ0603F270K is compatible with lead-free soldering processes, including reflow soldering and wave soldering. The component is designed to withstand the higher temperatures associated with lead-free soldering.
  • The moisture sensitivity level (MSL) of CRQ0603F270K is MSL 1, which means it can withstand exposure to moisture for up to 30 days without requiring baking or other special handling.
  • Yes, CRQ0603F270K is designed for use in high-reliability applications such as aerospace, defense, and medical devices. The component meets the requirements of various industry standards, including MIL-PRF-55342 and IEC 60384-16.

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CRGCQ0603F270K Overview

Use the download button to access the CRGCQ0603F270K schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CRGCQ, or try a keyword search, such as Metal Glaze/Thick Film Resistors

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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