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CRGCQ1210F68K - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length .122 INCH | Product Width 2.6 MM | Product Height .022 INCH | Product Length 3.1 MM | Product Height .55 MM | Product Width .102 INCH | Electrical Characteristics: Power Rating .5 WATT | Resistance Class 1kΩ – 1MΩ | Resistance Value 68K OHM | Passive Component Tolerance 1 PCT | Operating Voltage 200 V | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Package Size Code 1210 | Element Type Thick Film |

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CRGCQ1210F68K - TE Connectivity - PCB symbol
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CRGCQ1210F68K - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGCQ1210
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CRGCQ1210F68K - TE Connectivity - 3D model - Resistor Chip - CRGCQ1210
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CRGCQ1210F68K Details

  • Manufacturer Part Number:

    CRGCQ1210F68K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    12

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Physical Dimension:

    3.1mm x 2.6mm x .55mm

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    68000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

CRGCQ1210F68K Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGCQ1210F68K is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, CRGCQ1210F68K is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
  • To prevent damage, handle CRGCQ1210F68K by the edges or the body, avoiding touching the terminations or the ceramic body. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering profile for CRGCQ1210F68K is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. It's essential to follow the soldering profile recommended by TE Connectivity to ensure reliable assembly.
  • Yes, CRGCQ1210F68K is designed to withstand high-vibration and high-shock applications. The component is qualified to meet the requirements of various industry standards, including IEC 60068-2-27 and IEC 60068-2-6. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent damage.

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CRGCQ1210F68K Overview

Use the download button to access the CRGCQ1210F68K schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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