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CRGCQ1210J4M7 - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length 3.1 MM | Product Width .102 INCH | Product Height .55 MM | Product Height .022 INCH | Product Width 2.6 MM | Product Length .122 INCH | Electrical Characteristics: Resistance Class 1MΩ – 1GΩ | Power Rating .5 WATT | Resistance Value 4.7M OHM | Passive Component Tolerance 5 PCT | Operating Voltage 200 V | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type General Purpose Resistor | Element T

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CRGCQ1210J4M7 - TE Connectivity - PCB symbol
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CRGCQ1210J4M7 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGP1210
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CRGCQ1210J4M7 - TE Connectivity - 3D model - Resistor Chip - CRGP1210
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CRGCQ1210J4M7 Details

  • Manufacturer Part Number:

    CRGCQ1210J4M7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    12

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Physical Dimension:

    3.1mm x 2.6mm x .55mm

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    4700000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

CRGCQ1210J4M7 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGCQ1210J4M7 is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, CRGCQ1210J4M7 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
  • Yes, CRGCQ1210J4M7 is compatible with lead-free soldering processes. The component is designed to meet the requirements of the RoHS (Restriction of Hazardous Substances) directive and can be soldered using lead-free solder alloys.
  • The typical ESL of CRGCQ1210J4M7 is around 0.5nH to 1nH, depending on the frequency and operating conditions. This value is not explicitly stated in the datasheet, but it can be estimated based on the component's physical characteristics and the manufacturer's application notes.
  • Yes, CRGCQ1210J4M7 is suitable for high-frequency applications up to several hundred MHz. The component's low ESL and high self-resonant frequency (SRF) make it suitable for use in high-frequency circuits, such as RF filters, antennas, and impedance matching networks.

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CRGCQ1210J4M7 Overview

Use the download button to access the CRGCQ1210J4M7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CRGCQ, or try a keyword search, such as Fixed Resistors

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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