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CRGP1210F47K - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length 3.1 MM | Product Width .102 INCH | Product Width 2.6 MM | Product Height .022 INCH | Product Height .55 MM | Product Length .122 INCH | Electrical Characteristics: Passive Component Tolerance 1 PCT | Resistance Class 1kΩ – 1MΩ | Operating Voltage 200 V | Power Rating .75 WATT | Resistance Value 47K OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thick Film | Resistor Type General Pu

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CRGP1210F47K - TE Connectivity - PCB symbol
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PCB Footprints
CRGP1210F47K - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGP1210
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3D Models
CRGP1210F47K - TE Connectivity - 3D model - Resistor Chip - CRGP1210
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CRGP1210F47K Details

  • Manufacturer Part Number:

    CRGP1210F47K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    12

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.6 mm

  • Packing Method:

    TR

  • Physical Dimension:

    3.1mm x 2.6mm x .55mm

  • Rated Power Dissipation (P):

    0.75 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    47000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

CRGP1210F47K Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGP1210F47K is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, CRGP1210F47K is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
  • To prevent damage, handle CRGP1210F47K by the edges or the body, avoiding touching the terminations or the ceramic body. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering profile for CRGP1210F47K is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. It's essential to follow the soldering profile recommended by TE Connectivity to ensure reliable assembly.
  • CRGP1210F47K is a ceramic capacitor with a moisture sensitivity level (MSL) of 1, which means it can withstand normal humidity levels. However, it's not recommended for use in applications with extremely high humidity or moisture, as this can affect the component's reliability and lifespan.

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CRGP1210F47K Overview

Use the download button to access the CRGP1210F47K schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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