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CRGS0805J10K - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length 2 MM | Product Height .022 INCH | Product Height .55 MM | Product Length .079 INCH | Product Width .049 INCH | Product Width 1.25 MM | Electrical Characteristics: Resistance Class 1kΩ – 1MΩ | Passive Component Tolerance 5 PCT | Operating Voltage 150 V | Resistance Value 10K OHM | Power Rating .5 WATT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Package Size Code 0805 | Element Type Thick Film | R

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CRGS0805J10K - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGS0805
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CRGS0805J10K - TE Connectivity  - 3D model - Resistor Chip - CRGS0805
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CRGS0805J10K Details

  • Manufacturer Part Number:

    CRGS0805J10K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    12

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Physical Dimension:

    2mm x 1.25mm x .55mm

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    10000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    150 V

CRGS0805J10K Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGS0805J10K is a rectangular pad with a size of 1.2mm x 1.4mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper solder joint formation and reliability.
  • While CRGS0805J10K is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the solder joint reliability may be affected at high temperatures, so it's crucial to evaluate the design and assembly process.
  • To prevent damage, handle CRGS0805J10K by the body only, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. During assembly, ensure the component is properly aligned and seated on the PCB to prevent mechanical stress.
  • The recommended soldering process for CRGS0805J10K is a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time of 20-30 seconds above 220°C. Ensure the solder paste is compatible with the component's terminations and follows the manufacturer's recommended soldering profile.
  • While CRGS0805J10K is a robust component, it's essential to evaluate the design and assembly process for high-vibration or high-shock applications. Ensure the component is properly secured to the PCB, and consider using additional mechanical support or potting compounds to enhance reliability.

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CRGS0805J10K Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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Fixed Resistor, Metal Glaze/thick Film, 0.5W, 10000ohm, 150V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP