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CRGS2010J1R0 - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .55 MM | Product Length .197 INCH | Product Width 2.5 MM | Product Width .098 INCH | Product Length 5 MM | Product Height .022 INCH | Electrical Characteristics: Passive Component Tolerance 5 PCT | Power Rating .75 WATT | Operating Voltage 200 V | Resistance Class Up to 1kΩ | Resistance Value 1 OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thick Film | Package Size Code 2010 | Resist

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CRGS2010J1R0 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGS2010
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CRGS2010J1R0 - TE Connectivity  - 3D model - Resistor Chip - CRGS2010
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CRGS2010J1R0 Details

  • Manufacturer Part Number:

    CRGS2010J1R0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    10

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR

  • Physical Dimension:

    5mm x 2.5mm x .55mm

  • Rated Power Dissipation (P):

    0.75 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

CRGS2010J1R0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGS2010J1R0 is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
  • Yes, CRGS2010J1R0 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated for temperature and other environmental factors to ensure reliable operation.
  • To prevent damage, handle CRGS2010J1R0 by the body only, avoiding touching the terminations. Use a vacuum pickup or tweezers to handle the component. During rework, use a low-temperature soldering iron (below 260°C) and avoid applying excessive force or pressure to the component.
  • Yes, CRGS2010J1R0 is compatible with lead-free soldering processes. The component is designed to meet the requirements of RoHS and WEEE directives, and its terminations are made of a lead-free alloy.
  • Store CRGS2010J1R0 in its original packaging or in a dry, cool place (below 30°C and 60% RH). Avoid exposing the component to direct sunlight, moisture, or extreme temperatures. Handle the component in an ESD-protected environment to prevent damage from electrostatic discharge.

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CRGS2010J1R0 Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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For a full list of alternate parts for CRGS2010J1R0, check out Findchips.com