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CRGS2512J27R - TE Connectivity

Description: TE CONNECTIVITY - CRGS2512J27R - RES, 27R, 5%, 2512, THICK FILM

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CRGS2512J27R - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGS2512
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CRGS2512J27R - TE Connectivity  - 3D model - Resistor Chip - CRGS2512
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CRGS2512J27R Details

  • Manufacturer Part Number:

    CRGS2512J27R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    10

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.35 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR

  • Physical Dimension:

    6.35mm x 3.2mm x .55mm

  • Rated Power Dissipation (P):

    1.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    27 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    250 V

CRGS2512J27R Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGS2512J27R is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While CRGS2512J27R is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
  • To prevent electrostatic discharge (ESD) damage, handle CRGS2512J27R components in an ESD-controlled environment, use ESD-protective packaging, and follow proper grounding procedures during assembly and testing.
  • TE Connectivity recommends a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time of 20-30 seconds above 220°C. Ensure that the soldering process is optimized for the specific PCB material and component layout.
  • While CRGS2512J27R is not specifically designed for humid or moist environments, it can still be used in such conditions with proper precautions. Ensure that the component is properly sealed, and the PCB is designed with moisture-resistant materials and coatings.

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CRGS2512J27R Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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