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CRGS2512J3K3 - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .55 MM | Product Width 3.2 MM | Product Length .25 INCH | Product Length 6.35 MM | Product Height .022 INCH | Product Width .126 INCH | Electrical Characteristics: Power Rating 1.5 WATT | Resistance Value 3.3K OHM | Resistance Class 1kΩ – 1MΩ | Operating Voltage 250 V | Passive Component Tolerance 5 PCT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thick Film | Resistor Type General P

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CRGS2512J3K3 - TE Connectivity - PCB symbol
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CRGS2512J3K3 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGS2512
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CRGS2512J3K3 - TE Connectivity - 3D model - Resistor Chip - CRGS2512
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CRGS2512J3K3 Details

  • Manufacturer Part Number:

    CRGS2512J3K3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    10

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.35 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR

  • Physical Dimension:

    6.35mm x 3.2mm x .55mm

  • Rated Power Dissipation (P):

    1.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    3300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    250 V

CRGS2512J3K3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGS2512J3K3 is a rectangular pad with a size of 1.3 mm x 1.3 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper solder joint formation and reliability.
  • While the CRGS2512J3K3 is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management in your design. Ensure that the component is not exposed to temperatures above the recommended maximum, and provide adequate heat dissipation to prevent thermal stress.
  • To prevent electrostatic discharge (ESD) damage, handle the CRGS2512J3K3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that your production environment and storage facilities are ESD-safe, and follow proper handling and packaging procedures.
  • The recommended soldering profile for CRGS2512J3K3 is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. This ensures proper solder joint formation and minimizes the risk of thermal damage.
  • While the CRGS2512J3K3 is designed to operate in a variety of environments, it's essential to consider the moisture sensitivity level (MSL) of the component. Ensure that the device is properly sealed and protected from moisture, and follow proper handling and storage procedures to prevent moisture-related damage.

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CRGS2512J3K3 Overview

Use the download button to access the CRGS2512J3K3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CRGS2, or try a keyword search, such as Metal Glaze/Thick Film Resistors

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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