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CRM2512-FX-1004ELF - Bourns

Description: BOURNS - CRM2512-FX-1004ELF - CURRENT SENSE RES, 1M, 1%, 2W, 2512

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CRM2512-FX-1004ELF - Bourns - PCB symbol
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PCB Footprints
CRM2512-FX-1004ELF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CRM2512
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CRM2512-FX-1004ELF - Bourns - 3D model - Resistor Chip - CRM2512
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CRM2512-FX-1004ELF Details

  • Manufacturer Part Number:

    CRM2512-FX-1004ELF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    10

  • Additional Feature:

    CURRENT SENSING

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    6.3 mm

  • Package Style:

    SMT

  • Package Width:

    3.1 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    300 V

CRM2512-FX-1004ELF Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical layout with the chip resistors placed close to the IC, and the input and output traces should be kept short and away from noise sources. A ground plane is also recommended to reduce electromagnetic interference.
  • The CRM2512-FX-1004ELF has a maximum operating temperature of 125°C. Ensure good airflow around the component, and consider using a heat sink or thermal pad if the component will be operating near its maximum temperature rating.
  • Bourns recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C per second. Ensure that the component is not exposed to temperatures above 260°C for more than 10 seconds.
  • Use a gentle cleaning solution and a soft-bristled brush to remove any flux residue. Dry the component with a clean, lint-free cloth or air blower to prevent moisture accumulation.
  • Handle the component in an ESD-controlled environment, and use ESD-protective packaging and tools. Ensure that personnel handling the component are grounded using an ESD wrist strap or mat.

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CRM2512-FX-1004ELF Overview

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Part Image NRCW100F1004TRF NIC Components Corp

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