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CRM2512-JW-200ELF - Bourns

Description: Current Sense Resistors - SMD 2watts 5% 20ohms 200 PPM 2512

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CRM2512-JW-200ELF - Bourns - PCB symbol
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PCB Footprints
CRM2512-JW-200ELF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CRM2512
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CRM2512-JW-200ELF - Bourns - 3D model - Resistor Chip - CRM2512
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CRM2512-JW-200ELF Details

  • Manufacturer Part Number:

    CRM2512-JW-200ELF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    10

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    6.3 mm

  • Package Style:

    SMT

  • Package Width:

    3.1 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    20 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    300 V

CRM2512-JW-200ELF Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the CRM2512-JW-200ELF is a rectangular pad with dimensions of 2.5mm x 1.3mm, with a 0.5mm radius corner. The pad should be centered on the component and have a minimum of 0.2mm clearance around the component body.
  • The CRM2512-JW-200ELF has a maximum junction temperature of 150°C. To ensure reliable operation, the component should be mounted on a PCB with a thermal conductivity of at least 1 W/m-K. Additionally, a thermal via or thermal pad can be used to improve heat dissipation.
  • The recommended soldering profile for the CRM2512-JW-200ELF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The component should be soldered using a solder with a melting point of 217°C or higher.
  • After soldering, the CRM2512-JW-200ELF should be cleaned with a mild detergent and deionized water to remove any flux residue. The component should then be dried with a soft brush or air blower to prevent moisture accumulation.
  • The CRM2512-JW-200ELF should be stored in a dry, cool place away from direct sunlight and moisture. The component should be handled with anti-static wrist straps or mats to prevent electrostatic discharge damage.

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CRM2512-JW-200ELF Overview

Use the download button to access the CRM2512-JW-200ELF schematic symbol, PCB footprint, and 3D model.
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