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CS51414EDR8G - onsemi

Description: Synchronization Function; 2.0% Error Amp Reference Voltage Tolerance; Thermal Shutdown; Pin-Compatible with LT1375 and LT1376; 85uA Quiescent Current During Power-Down; V2 Architecture Provides Ultra-Fast Transient Response, Improved Regulation and Simplified Design; Switch Frequency Decrease of 4:1 in Short Circuit Conditions ; Shutdown Lead Provides Power-Down Option; Soft Start; BOOST pin for Bootstrapped Operation; Pb-Free Packages are Available

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CS51414EDR8G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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CS51414EDR8G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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CS51414EDR8G Details

  • Manufacturer Part Number:

    CS51414EDR8G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.7

  • Additional Feature:

    CURRENT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    594 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

CS51414EDR8G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • The high current handling capability of the CS51414EDR8G requires careful PCB design to ensure that the traces and vias can handle the high currents. Use wide traces, multiple vias, and a solid power plane to minimize resistance and inductance.
  • Use a voltage regulator or a transient voltage suppressor to protect the device from overvoltage conditions. Also, consider using a current sense resistor and a fuse or a current limiter to protect the device from overcurrent conditions.
  • The CS51414EDR8G is a high-frequency device that can generate EMI and RFI. Use shielding, filtering, and grounding techniques to minimize EMI and RFI emissions. Also, ensure that the PCB is designed to minimize radiation and conduction of electromagnetic energy.

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CS51414EDR8G Overview

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Part Image CS51414GDR8 Cherry Semiconductor Corporation

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Part Image CS51414GD8 Cherry Semiconductor Corporation

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