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CS5172EDR8G - onsemi

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CS5172EDR8G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8
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CS5172EDR8G Details

  • Manufacturer Part Number:

    CS5172EDR8G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    8 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    310 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

CS5172EDR8G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
  • Follow the recommended soldering profile: 260°C peak temperature, 30-60 seconds dwell time, and 10-20 seconds ramp-up and cool-down times. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.

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CS5172EDR8G Overview

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CS5172EDR8G Alternates

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Part Image CS5171EDR8G Rochester Electronics LLC

2.4 A SWITCHING REGULATOR, 310 kHz SWITCHING FREQ-MAX, PDSO8, LEAD FREE, SOIC-8

Part Image CS5173ED8 Rochester Electronics LLC

2.4A SWITCHING REGULATOR, 620kHz SWITCHING FREQ-MAX, PDSO8, SOIC-8

Part Image CS5171ED8G Rochester Electronics LLC

2.4 A SWITCHING REGULATOR, 310 kHz SWITCHING FREQ-MAX, PDSO8, LEAD FREE, SOIC-8

Part Image CS5173EDR8 Rochester Electronics LLC

2.4A SWITCHING REGULATOR, 620kHz SWITCHING FREQ-MAX, PDSO8, SOIC-8

Part Image CS5172ED8G onsemi

Switching Regulator, Current-mode, 2.4A, 310kHz Switching Freq-Max, BIPolar, PDSO8

For a full list of alternate parts for CS5172EDR8G, check out Findchips.com