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CS5173EDR8G - onsemi

Description: ON Semiconductor CS5173EDR8G, Boost Converter, Step Up 1.5A, 560 kHz, 8-Pin SOIC

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CS5173EDR8G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 CASE 751-07 ISSUE AJ
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CS5173EDR8G - onsemi  - 3D model - Small Outline Packages - SOIC-8 CASE 751-07 ISSUE AJ
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CS5173EDR8G Details

  • Manufacturer Part Number:

    CS5173EDR8G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    8 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    620 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

CS5173EDR8G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, ensure proper PCB layout, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) between the device and heat sink.
  • Choose a heat sink with a high thermal conductivity, low thermal resistance, and a surface finish compatible with the device's package. Ensure the heat sink is properly mounted and secured to the device.
  • Use a multi-layer PCB with a solid ground plane, keep sensitive traces away from the device, and use shielding or filtering components as needed. Follow proper PCB layout and routing guidelines.
  • Follow the onsemi recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds, and a maximum of 3 reflows. Use a solder with a melting point above 217°C.

Trust Checks

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CS5173EDR8G Overview

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