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CSD01060E - Wolfspeed

Description: 600 V, 1 A, TO-252-2 package, Industrial qualified, Discrete SiC Schottky Diode

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CSD01060E - Wolfspeed PCB footprint - Other - Other - TO-252-2_1
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CSD01060E - Wolfspeed  - 3D model - Other - TO-252-2_1
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CSD01060E Details

  • Manufacturer Part Number:

    CSD01060E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Non-rep Pk Forward Current-Max:

    32 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    21.4 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

CSD01060E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the CSD01060E is -55°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings in the datasheet, and use a suitable voltage regulator and decoupling capacitors to minimize noise and voltage drops.
  • For optimal thermal performance, use a multi-layer PCB with thermal vias, and ensure good thermal conductivity between the device and the heat sink. Follow the recommended land pattern and thermal pad layout in the datasheet.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Follow the recommended ESD protection circuit in the datasheet.
  • Use a suitable drive circuitry, such as a gate driver IC or a discrete transistor, to ensure proper voltage and current levels for the device. Follow the recommended drive circuitry in the datasheet.

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CSD01060E Overview

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