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CSNL1206FT8L00 - Stackpole Electronics, Inc.

Description: RES SHUNT, 1206, 0.008 ohm, 1%, 1W

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CSNL1206FT8L00 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
CSNL1206FT8L00 - Stackpole Electronics, Inc. PCB footprint - Other - Other - CSNL1206
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3D Models
CSNL1206FT8L00 - Stackpole Electronics, Inc. - 3D model - Other - CSNL1206
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CSNL1206FT8L00 Details

  • Manufacturer Part Number:

    CSNL1206FT8L00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    7.7

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    80 °C

  • Resistance:

    0.008 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

CSNL1206FT8L00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the CSNL1206FT8L00 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal management.
  • While the CSNL1206FT8L00 has a rated operating temperature range of -55°C to 150°C, it's essential to consider the derating curve and thermal management when using it in high-temperature applications. Ensure proper heat sinking and follow the manufacturer's guidelines for high-temperature operation.
  • The CSNL1206FT8L00 is a moisture-sensitive device. To prevent damage, store it in a dry environment (less than 20% RH) and follow the manufacturer's recommended handling and storage procedures. If the component is exposed to moisture, follow the recommended baking procedure before soldering.
  • The recommended soldering profile for the CSNL1206FT8L00 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure the soldering process is within the manufacturer's specified temperature and time limits to prevent damage.
  • While the CSNL1206FT8L00 is designed to be robust, it's essential to consider the vibration environment and ensure proper mounting and mechanical support. Follow the manufacturer's guidelines for vibration testing and consider additional mechanical reinforcement if necessary.

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CSNL1206FT8L00 Overview

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