CSR0805FK75L0 - Stackpole Electronics, Inc.

CSR0805FK75L0 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the CSR0805FK75L0?
  The recommended land pattern for the CSR0805FK75L0 is a rectangular pad with a size of 0.8mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use the CSR0805FK75L0 in high-temperature applications?
  The CSR0805FK75L0 is rated for operation up to 150°C, but it's recommended to derate the power rating by 50% when operating above 125°C. It's also important to ensure that the PCB and surrounding components can withstand the high temperatures.
• How do I handle the CSR0805FK75L0 during PCB assembly to prevent damage?
  Handle the CSR0805FK75L0 by the edges to prevent damage to the resistive element. Avoid touching the component with bare hands, as the oils from skin can cause damage. Use anti-static wrist straps and mats to prevent electrostatic discharge (ESD) damage.
• Can I use the CSR0805FK75L0 in high-humidity environments?
  The CSR0805FK75L0 is rated for operation in environments with relative humidity up to 85%. However, it's recommended to use conformal coating or potting to protect the component from moisture in high-humidity environments.
• What is the recommended soldering profile for the CSR0805FK75L0?
  The recommended soldering profile for the CSR0805FK75L0 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.