TDK-Lambda recommends a multi-layer PCB with a solid ground plane and a thermal pad connected to a heat sink or a metal plate to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the PCB.
To ensure EMC, TDK-Lambda recommends using a metal enclosure, adding EMI filters, and following proper PCB layout and grounding techniques. Additionally, the CUT35-522 has built-in EMI filters, but external filtering may still be required depending on the application.
The derating curve for the CUT35-522 is not explicitly provided in the datasheet. However, TDK-Lambda recommends derating the output power by 2.5% per degree Celsius above 50°C to ensure reliable operation.
Yes, the CUT35-522 can be used in a redundant or parallel configuration, but it requires additional external circuitry and careful design consideration to ensure proper operation and fault tolerance.
The MTBF of the CUT35-522 is not explicitly stated in the datasheet. However, TDK-Lambda provides a reliability report that estimates the MTBF based on MIL-HDBK-217F calculations. Contact TDK-Lambda for more information.
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CUT35-522 Overview
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