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CV201210-3R3K - Bourns

Description: Inductor RF Shielded Multi-Layer 3.3uH 10% 10MHz 45Q-Factor Ferrite 0.03A 0.8Ohm DCR 0805 T/R

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PCB Footprints
CV201210-3R3K - Bourns PCB footprint - Inductors Chip - Inductors Chip - CV201210-100K(0.45)
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3D Models
CV201210-3R3K - Bourns  - 3D model - Inductors Chip - CV201210-100K(0.45)
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CV201210-3R3K Details

  • Manufacturer Part Number:

    CV201210-3R3K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.8 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.03 A

  • Self Resonance Frequency:

    41 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    MULTILAYER

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

CV201210-3R3K Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal track lengths is recommended to reduce electromagnetic interference (EMI) and ensure optimal performance.
  • The CV201210-3R3K has a high power rating, so it's essential to ensure good thermal conductivity. Use a thermal pad or thermal interface material (TIM) to improve heat transfer between the component and the PCB or heat sink.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to note that the component's performance may degrade above 100°C. Ensure proper thermal management to maintain optimal performance.
  • The CV201210-3R3K is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, consider using additional mechanical support or a vibration-dampening material to ensure the component's reliability.
  • To prevent moisture-related issues, ensure the component is stored and operated in a dry environment. If exposure to high humidity is unavoidable, consider using a conformal coating or potting compound to protect the component.

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CV201210-3R3K Overview

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