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CW201212-10NJ - Bourns

Description: Fixed Inductors 10nH 5%

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CW201212-10NJ - Bourns PCB footprint - Other - Other - CW201212-10NJ-3
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CW201212-10NJ - Bourns  - 3D model - Other - CW201212-10NJ-3
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CW201212-10NJ Details

  • Manufacturer Part Number:

    CW201212-10NJ

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.12 Ω

  • Inductance-Nom (L):

    0.01 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.6 A

  • Self Resonance Frequency:

    4300 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    Q IS MEASURED AT 500MHZ

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    250 MHz

  • Tolerance:

    5%

CW201212-10NJ Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure proper thermal management, minimize electromagnetic interference, and optimize the component's performance.
  • While the datasheet provides temperature ratings, it's essential to note that the component's performance may degrade at high temperatures. Engineers should consider derating the component's specifications and consulting with Bourns' application engineers for specific guidance on high-temperature applications.
  • Bourns recommends following standard ESD handling precautions, such as using wrist straps, anti-static bags, and grounded workstations. Additionally, engineers should ensure that their manufacturing process and storage facilities are ESD-protected to prevent damage to the component.
  • While the datasheet doesn't explicitly mention vibration or shock resistance, Bourns' components are designed to meet industry standards for reliability. However, engineers should consult with Bourns' application engineers to determine the component's suitability for specific high-vibration or high-shock applications.
  • Bourns provides guidelines for soldering and rework in their application notes. Engineers should follow these guidelines to ensure proper soldering techniques, temperature profiles, and rework procedures to prevent damage to the component.

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CW201212-10NJ Overview

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