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CY14B064I-SFXI - Infineon

Description: NVRAM 64Kb 3V 3.4Mhz 8K x 8 SPI nvSRAM

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PCB Footprints
CY14B064I-SFXI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC (0.413 × 0.299 × 0.0932 Inches), 51-85022
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3D Models
CY14B064I-SFXI - Infineon  - 3D model - Small Outline Packages - 16-Pin SOIC (0.413 × 0.299 × 0.0932 Inches), 51-85022
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CY14B064I-SFXI Details

  • Manufacturer Part Number:

    CY14B064I-SFXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.28 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    NON-VOLATILE SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.667 mm

  • Standby Current-Max:

    0.00025 A

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.495 mm

CY14B064I-SFXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN20060, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The CY14B064I-SFXI requires a specific power-up and power-down sequencing to prevent damage or malfunction. Infineon recommends following the power-up and power-down sequence outlined in the datasheet, with VCC powering up before VPP and powering down in the reverse order.
  • The CY14B064I-SFXI has a maximum junction temperature of 150°C. To ensure reliable operation, Infineon recommends using a thermal pad or heat sink to dissipate heat, and following the thermal management guidelines outlined in the datasheet and application notes.
  • The CY14B064I-SFXI has a hardware write protection feature that can be enabled through the WP pin. Infineon recommends using a pull-up resistor and a capacitor to ensure reliable write protection, and following the guidelines outlined in the datasheet and application notes.
  • The CY14B064I-SFXI is AEC-Q100 qualified, making it suitable for automotive applications. For high-reliability applications, Infineon recommends following the guidelines outlined in the datasheet and application notes, including using a robust PCB design, implementing error detection and correction mechanisms, and performing thorough testing and validation.

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