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CY14E256LA-SZ25XI - Infineon

Description: Cypress Semiconductor SRAM Memory Chip, CY14E256LA-SZ25XI- 256kbit

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CY14E256LA-SZ25XI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 32-pin SOIC (300 Mil) Package Outline, 51-85127
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CY14E256LA-SZ25XI - Infineon  - 3D model - Small Outline Packages - 32-pin SOIC (300 Mil) Package Outline, 51-85127
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CY14E256LA-SZ25XI Details

  • Manufacturer Part Number:

    CY14E256LA-SZ25XI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Access Time-Max:

    25 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    20.726 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    NON-VOLATILE SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    32

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Standby Current-Max:

    0.008 A

  • Standby Voltage-Min:

    4.5 V

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    7.55 mm

CY14E256LA-SZ25XI Frequently Asked Questions (FAQs)

  • The recommended storage temperature range for the CY14E256LA-SZ25XI is -65°C to +150°C.
  • To prevent damage, it is recommended to follow the soldering temperature profile specified in the datasheet, and to avoid exposing the device to temperatures above 260°C for more than 10 seconds.
  • The CY14E256LA-SZ25XI is specified to handle up to 100,000 program/erase cycles.
  • To ensure data retention, it is recommended to store the device in a cool, dry place, away from direct sunlight and radiation sources. The device should also be handled and stored in accordance with the recommended storage conditions.
  • The typical power consumption of the CY14E256LA-SZ25XI is 5mA active, 1mA standby, and 1μA sleep.

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CY14E256LA-SZ25XI Overview

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Part Image CY14E256LA-SZ25XIT Cypress Semiconductor

Non-Volatile SRAM, 32KX8, 25ns, CMOS, PDSO32

Part Image CY14E256LA-SZ25XI Cypress Semiconductor

Non-Volatile SRAM, 32KX8, 25ns, CMOS, PDSO32