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CY15B064J-SXE - Infineon

Description: F-RAM F-RAM Memory Serial

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CY15B064J-SXE - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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CY15B064J-SXE - Infineon  - 3D model - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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CY15B064J-SXE Details

  • Manufacturer Part Number:

    CY15B064J-SXE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

  • Clock Frequency-Max (fCLK):

    1 MHz

  • Data Retention Time-Min:

    11

  • Endurance:

    10000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.889 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.727 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.00002 A

  • Standby Voltage-Min:

    3 V

  • Supply Current-Max:

    0.00034 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.8985 mm

  • Write Protection:

    HARDWARE

CY15B064J-SXE Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN215, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CY15B064J-SXE requires a specific power-up and power-down sequence to ensure proper operation. Infineon recommends following the sequence outlined in the datasheet, which includes powering up VCC before VPP and powering down VPP before VCC.
  • The CY15B064J-SXE has a maximum junction temperature of 150°C. To ensure reliable operation, Infineon recommends using a thermal pad or heat sink to dissipate heat, and following the thermal management guidelines outlined in the datasheet.
  • The CY15B064J-SXE has built-in data retention and security features, such as a battery-backed SRAM and a secure erase function. Infineon provides guidelines for implementing these features in their application note AN217, which includes code examples and design recommendations.
  • Infineon provides additional documentation and support for using the CY15B064J-SXE in high-reliability or automotive applications, including AEC-Q100 qualification and PPAP (Production Part Approval Process) support. Engineers should consult Infineon's automotive and high-reliability resources for specific guidance.

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