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CY15B102QSN-108SXI - Infineon

Description: 4-Mbit ferroelectric random access memory (F-RAM) logically organized as 512K × 8 - Virtually unlimited endurance of 100 trillion (1014) read/write cycles - 151-year data retention (see “Data retention and endurance” on page 101) - Infineon instant non-volatile write technology - Advanced high-reliability ferroelectric process • Single and multi I/O serial peripheral interface (SPI) - Serial bus interface SPI protocols - Supports SPI mode 0 (0, 0) and mode 3 (1, 1) for all SDR mode transfers - Suppo

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CY15B102QSN-108SXI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-pin SOIC (208 Mils) 001-85261
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CY15B102QSN-108SXI - Infineon  - 3D model - Small Outline Packages - 8-pin SOIC (208 Mils) 001-85261
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CY15B102QSN-108SXI Details

  • Manufacturer Part Number:

    CY15B102QSN-108SXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    2kv ESD available

  • Clock Frequency-Max (fCLK):

    108 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5.28 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Seated Height-Max:

    2.03 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00035 A

  • Standby Voltage-Min:

    1.8 V

  • Supply Current-Max:

    0.021 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    5.23 mm

  • Write Protection:

    HARDWARE/SOFTWARE

CY15B102QSN-108SXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CY15B102QSN-108SXI requires a specific power-up and power-down sequence to ensure proper operation. Infineon recommends following the sequence outlined in the datasheet, which involves powering up VCC before VPP and powering down VPP before VCC.
  • The CY15B102QSN-108SXI has a maximum junction temperature of 150°C. To ensure reliable operation, Infineon recommends using a thermal pad on the PCB, keeping the device away from heat sources, and using a heat sink if necessary. The thermal resistance (RthJA) is specified in the datasheet.
  • The CY15B102QSN-108SXI is an industrial-grade device, but it may not meet the specific requirements for high-reliability or automotive applications. Infineon offers other devices with enhanced reliability and quality features, such as the AEC-Q100 qualified CY15B102QSN-108SXIT, which may be more suitable for these applications.
  • The CY15B102QSN-108SXI has a built-in battery backup feature that allows it to retain data during power failures. To implement data retention, connect a battery to the VCC pin and ensure that the battery voltage is within the recommended range. Additionally, use a diode or a switch to isolate the battery from the main power supply.

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