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CY15B108QSN-108BKXI - Infineon

Description: Ferroelectric RAM, 1M x 8bit, 108 MHz, 1.8 V to 3.6 Vin, QSPI, FBGA-24, -40 °C to 85 °C

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PCB Footprints
CY15B108QSN-108BKXI - Infineon PCB footprint - BGA - BGA - PG-BGA-24-800
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3D Models
CY15B108QSN-108BKXI - Infineon  - 3D model - BGA - PG-BGA-24-800
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CY15B108QSN-108BKXI Details

  • Manufacturer Part Number:

    CY15B108QSN-108BKXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-24

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    108 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000435 A

  • Supply Current-Max:

    0.0275 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

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