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CY15B116QSN-108BKXI - Infineon

Description: F-RAM F-RAM Memory Serial

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PCB Footprints
CY15B116QSN-108BKXI - Infineon PCB footprint - BGA - BGA - 24L FBGA 8*6 *1.2 mm BK24A
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CY15B116QSN-108BKXI - Infineon  - 3D model - BGA - 24L FBGA 8*6 *1.2 mm BK24A
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CY15B116QSN-108BKXI Details

  • Manufacturer Part Number:

    CY15B116QSN-108BKXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-24

  • Country Of Origin:

    Thailand

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

  • Clock Frequency-Max (fCLK):

    108 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00056 A

  • Standby Voltage-Min:

    1.8 V

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

CY15B116QSN-108BKXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2013-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CY15B116QSN-108BKXI has a thermal pad on the bottom side of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. Additionally, ensure good airflow around the device and consider using a heat sink if the operating conditions exceed the recommended temperature range.
  • The CY15B116QSN-108BKXI is specified to operate up to 108 MHz, but the actual operating frequency may be limited by the system design, PCB layout, and signal integrity. It's essential to perform signal integrity analysis and simulation to ensure reliable operation at the desired frequency.
  • To ensure reliable data retention, follow the recommended storage conditions, handle the device with care to avoid physical stress, and use a secure erase procedure before reprogramming the device. Additionally, consider implementing error correction mechanisms and data redundancy in the system design.
  • The CY15B116QSN-108BKXI requires a single 3.3V power supply (VCC) with a recommended operating range of 3.0V to 3.6V. Ensure a stable power supply with minimal noise and ripple to prevent device malfunction or data corruption.

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