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CY15V116QSN-108BKXI - Infineon

Description: FRAM (Ferroelectric RAM) Memory IC 16Mbit SPI - Quad I/O, QPI 108 MHz 6.7 ns 24-FBGA (6x8)

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PCB Footprints
CY15V116QSN-108BKXI - Infineon PCB footprint - BGA - BGA - 24L FBGA 8 × 6 × 1.2 mm BK24A
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CY15V116QSN-108BKXI - Infineon  - 3D model - BGA - 24L FBGA 8 × 6 × 1.2 mm BK24A
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CY15V116QSN-108BKXI Details

  • Manufacturer Part Number:

    CY15V116QSN-108BKXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-24

  • Country Of Origin:

    Thailand

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

  • Clock Frequency-Max (fCLK):

    108 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00042 A

  • Standby Voltage-Min:

    1.71 V

  • Supply Current-Max:

    0.0275 mA

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

CY15V116QSN-108BKXI Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • Thermal management is crucial for this device. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. The device's thermal pad should be connected to a solid ground plane to improve heat dissipation.
  • Power sequencing is critical for this device. Ensure that the supply voltage (VCC) is applied before the clock signal, and that the voltage ramps up slowly to prevent damage. The recommended supply voltage is 1.7V to 1.9V, with a maximum tolerance of ±10%.
  • To ensure data integrity, use a robust clock signal, and ensure that the clock frequency is within the recommended range. Also, use a pull-up resistor on the data lines, and consider using a CRC or ECC to detect and correct data errors.
  • The CY15V116QSN-108BKXI has built-in ESD protection, but handling precautions are still necessary. Handle the device by the body or the pins, avoid touching the pins, and use an anti-static wrist strap or mat when handling the device.

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