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CY22150FZXC - Infineon

Description: Programable clock,1xPLL,CY22150FZXC Cypress Semiconductor CY22150FZXC, PLL Clock Synthesizer, 0.08 → 200 MHz, 16-Pin TSSOP

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PCB Footprints
CY22150FZXC - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-pin TSSOP (4.40 mm Body) Package Outline, 51-85091
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3D Models
CY22150FZXC - Infineon  - 3D model - Small Outline Packages - 16-pin TSSOP (4.40 mm Body) Package Outline, 51-85091
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CY22150FZXC Details

  • Manufacturer Part Number:

    CY22150FZXC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    OPERATES AT 2.5 V MINIMUM SUPPLY AT 166.6 MHZ

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Clock Frequency-Max:

    200 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    30 MHz

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, OTHER

CY22150FZXC Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the clock signal traces short and away from noisy signals. Use a common mode filter or a ferrite bead to reduce EMI.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material to improve heat transfer between the device and the heat sink. Follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure and ensure good grounding practices. Keep the clock signal traces short and away from the PCB edge. Use a common mode filter or a ferrite bead to reduce EMI. Follow the recommended layout guidelines for the device.
  • Use a logic analyzer or an oscilloscope to monitor the clock signals and verify proper operation. Check the power supply voltage and ensure it is within the recommended range. Verify the PCB layout and ensure it meets the recommended guidelines.
  • Ensure the power supply voltage is within the recommended range (1.71V to 1.89V). Use a low-dropout regulator (LDO) or a switching regulator with a low noise output. Follow the recommended power-up and power-down sequencing guidelines.

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CY22150FZXC Overview

Use the download button to access the CY22150FZXC schematic symbol, PCB footprint, and 3D model.
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