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CY62128ELL-55SXE - Infineon

Description: SRAM 1Mb 55ns 128K x 8 Low Power SRAM

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CY62128ELL-55SXE - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 32-pin Molded SOIC (450 Mil)
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CY62128ELL-55SXE - Infineon  - 3D model - Small Outline Packages - 32-pin Molded SOIC (450 Mil)
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CY62128ELL-55SXE Details

  • Manufacturer Part Number:

    CY62128ELL-55SXE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4

  • Access Time-Max:

    55 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    20.4465 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP32,.56

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.997 mm

  • Standby Current-Max:

    0.00003 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    11.33 mm

CY62128ELL-55SXE Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN201908-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The CY62128ELL-55SXE requires a specific power-up and power-down sequencing to prevent latch-up and ensure proper operation. Infineon recommends following the power-up and power-down sequence outlined in their application note AN201908-01.
  • The CY62128ELL-55SXE has a high power density, and proper thermal management is crucial to prevent overheating. Infineon recommends using a heat sink, thermal interface material, and ensuring good airflow around the device to keep the junction temperature below 125°C.
  • A reliable reset circuit is essential to ensure proper device operation. Infineon recommends using a reset circuit with a capacitor and a resistor to filter out noise and ensure a clean reset signal. A detailed example is provided in their application note AN201908-01.
  • The CY62128ELL-55SXE has built-in ESD protection, but additional protection measures may be necessary depending on the application. Infineon recommends following the ESD protection guidelines outlined in their application note AN201908-01, including the use of ESD protection diodes and resistors.

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CY62128ELL-55SXE Overview

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