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CY62136EV30LL-45BVXIT - Infineon

Description: SRAM 2Mb 3V 45ns 128K x 16 LP SRAM

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CY62136EV30LL-45BVXIT Details

  • Manufacturer Part Number:

    CY62136EV30LL-45BVXIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    45 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA48,6X8,30

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Standby Current-Max:

    0.000003 A

  • Standby Voltage-Min:

    1 V

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    6 mm

CY62136EV30LL-45BVXIT Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the power and ground planes separate, using a solid ground plane, and minimizing signal trace lengths.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines provided in the datasheet. Additionally, consider using thermal interface materials to improve heat transfer.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. The device has built-in ESD protection, but it is still important to take precautions during handling and assembly.
  • The CY62136EV30LL-45BVXIT is a commercial-grade device, but it can be used in high-reliability or safety-critical applications with proper design, testing, and validation. Consult with Infineon Technologies AG for specific guidance and support.
  • Follow the power-on and power-off sequences recommended in the datasheet to ensure proper device operation and prevent damage. Typically, this involves powering on the device in a specific order (e.g., VCC, then VIO) and powering off in the reverse order.

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CY62136EV30LL-45BVXIT Overview

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