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CY62137FV30LL-45BVXI - Infineon

Description: Cypress Semiconductor CY62137FV30LL-45BVXI SRAM Memory, 2Mbit, 2.2 → 3.6 V, 45ns 48-Pin FBGA

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PCB Footprints
CY62137FV30LL-45BVXI - Infineon PCB footprint - BGA - BGA - 48-Ball VFBGA (6 x 8 x 1 mm) 51-85150
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CY62137FV30LL-45BVXI - Infineon  - 3D model - BGA - 48-Ball VFBGA (6 x 8 x 1 mm) 51-85150
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CY62137FV30LL-45BVXI Details

  • Manufacturer Part Number:

    CY62137FV30LL-45BVXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    45 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA48,6X8,30

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Standby Current-Max:

    0.000004 A

  • Standby Voltage-Min:

    1.5 V

  • Supply Current-Max:

    0.018 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    6 mm

CY62137FV30LL-45BVXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN201908-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The CY62137FV30LL-45BVXI requires a specific power-up and power-down sequencing to prevent latch-up and ensure proper operation. Refer to the Infineon application note AN201908-01 for detailed guidelines on power sequencing and voltage ramp rates.
  • The CY62137FV30LL-45BVXI has a high power density, and thermal management is crucial to prevent overheating. Ensure good airflow, use thermal vias, and consider heat sinks or thermal interface materials to keep the junction temperature below 125°C.
  • A reliable reset circuit is essential for proper device operation. Infineon recommends using a reset circuit with a capacitor and a resistor to ensure a clean reset signal. Refer to the datasheet and application notes for specific guidelines.
  • The CY62137FV30LL-45BVXI has built-in ESD protection, but additional protection measures may be necessary depending on the application. Ensure that the PCB design and handling procedures follow ESD-safe practices to prevent damage.

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Part Image CY62137FV30LL-45BVXIT Infineon Technologies AG

Standard SRAM, 128KX16, 45ns, CMOS, PBGA48

Part Image CY62137FV30LL-45BVXI Cypress Semiconductor

Standard SRAM, 128KX16, 45ns, CMOS, PBGA48