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CY62137FV30LL-45ZSXI - Infineon

Description: Cypress Semiconductor CY62137FV30LL-45ZSXI SRAM Memory, 2Mbit, 2.2 → 3.6 V, 45ns 44-Pin TSOP

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CY62137FV30LL-45ZSXI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 44-pin TSOP Z44-II -+-++
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CY62137FV30LL-45ZSXI - Infineon  - 3D model - Small Outline Packages - 44-pin TSOP Z44-II -+-++
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CY62137FV30LL-45ZSXI Details

  • Manufacturer Part Number:

    CY62137FV30LL-45ZSXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    45 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e4

  • Length:

    18.415 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Equivalence Code:

    TSOP44,.46,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.194 mm

  • Standby Current-Max:

    0.000004 A

  • Standby Voltage-Min:

    1.5 V

  • Supply Current-Max:

    0.018 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    10.16 mm

CY62137FV30LL-45ZSXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN201908-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The CY62137FV30LL-45ZSXI requires a specific power-up and power-down sequencing to prevent latch-up and ensure proper operation. Refer to the Infineon application note AN201908-01 for detailed guidelines on power sequencing and voltage ramp rates.
  • The CY62137FV30LL-45ZSXI has a high power density, and proper thermal management is crucial to prevent overheating. Ensure good airflow, use thermal vias, and consider heat sinks or thermal interface materials to keep the junction temperature below 125°C.
  • A reliable reset circuit is essential for the CY62137FV30LL-45ZSXI. Use a reset IC or a discrete reset circuit with a capacitor and resistor to ensure a clean reset signal. Refer to the Infineon application note AN201908-01 for a recommended reset circuit design.
  • The CY62137FV30LL-45ZSXI has built-in ESD protection, but additional protection measures may be necessary depending on the application. Use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent ESD damage.

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