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CY62157EV30LL-45ZSXI - Infineon

Description: Cypress Semiconductor CY62157EV30LL-45ZSXI SRAM Memory, 8Mbit, 2.2 → 3.6 V, 45ns 44-Pin TSOP

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PCB Footprints
CY62157EV30LL-45ZSXI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 44-pin TSOP Package Outline, 51-85087
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CY62157EV30LL-45ZSXI - Infineon  - 3D model - Small Outline Packages - 44-pin TSOP Package Outline, 51-85087
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CY62157EV30LL-45ZSXI Details

  • Manufacturer Part Number:

    CY62157EV30LL-45ZSXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    45 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e4

  • Length:

    18.415 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX16

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Equivalence Code:

    TSOP44,.46,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.194 mm

  • Standby Current-Max:

    0.000008 A

  • Standby Voltage-Min:

    1.5 V

  • Supply Current-Max:

    0.025 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    10.16 mm

CY62157EV30LL-45ZSXI Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the package to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, add series termination resistors, and consider using differential signaling. Also, follow the recommended routing guidelines and layout considerations outlined in the datasheet.
  • The power-up sequence should be VCCQ, then VCC, and finally VREF. For power-down, the sequence should be reversed. Ensure that VCCQ is powered down last to prevent any unwanted current flow.
  • Use a JTAG adapter or a debug probe that supports the IEEE 1149.1 standard. Ensure that the JTAG clock frequency does not exceed 10 MHz, and use the recommended JTAG signal termination and routing guidelines.
  • Operate the device within the recommended temperature range of -40°C to 85°C, and ensure the power supply voltage is within the specified range of 1.14V to 1.26V. Also, follow the recommended operating conditions for the input and output signals.

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CY62157EV30LL-45ZSXI Overview

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Part Image CY62157EV30LL-45ZSXA Infineon Technologies AG

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Part Image CY62157G30-45ZSXA Infineon Technologies AG

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Part Image CY62157ESL-45ZSXIT Infineon Technologies AG

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