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CY62157EV30LL-55ZSXE - Infineon

Description: Cypress Semiconductor CY62157EV30LL-55ZSXE SRAM Memory, 8Mbit, 2.2 → 3.6 V, 55ns 44-Pin TSOP

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PCB Footprints
CY62157EV30LL-55ZSXE - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 44-pin TSOP Package Outline, 51-85087
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CY62157EV30LL-55ZSXE - Infineon  - 3D model - Small Outline Packages - 44-pin TSOP Package Outline, 51-85087
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CY62157EV30LL-55ZSXE Details

  • Manufacturer Part Number:

    CY62157EV30LL-55ZSXE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    55 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e4

  • Length:

    18.415 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX16

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Equivalence Code:

    TSOP44,.46,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.194 mm

  • Standby Current-Max:

    0.00003 A

  • Standby Voltage-Min:

    1.5 V

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    10.16 mm

CY62157EV30LL-55ZSXE Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN201908-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The datasheet recommends a specific power-up and power-down sequencing to prevent damage to the device. It's essential to follow the recommended sequence to ensure the device operates correctly and to prevent latch-up or other issues.
  • The CY62157EV30LL-55ZSXE has a maximum junction temperature of 150°C. To ensure reliable operation, it's crucial to implement proper thermal management, such as using thermal vias, heat sinks, or thermal interface materials, to keep the device within its recommended operating temperature range.
  • The CY62157EV30LL-55ZSXE is not specifically designed for radiation-intensive environments. If your application requires radiation hardness, you should consult with Infineon or consider using a radiation-hardened equivalent device.
  • Infineon recommends following the JEDEC J-STD-020D.1 standard for soldering the CY62157EV30LL-55ZSXE. This standard provides guidelines for temperature, time, and other parameters to ensure reliable solder joints.

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CY62157EV30LL-55ZSXE Overview

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