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CY62167ELL-45ZXIT - Infineon

Description: SRAM 16Mb 1M x16 Low Power SRAM

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CY62167ELL-45ZXIT - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - TS 048—48-Pin Standard TSOP_2
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CY62167ELL-45ZXIT - Infineon  - 3D model - Small Outline Packages - TS 048—48-Pin Standard TSOP_2
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CY62167ELL-45ZXIT Details

  • Manufacturer Part Number:

    CY62167ELL-45ZXIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4

  • Access Time-Max:

    45 ns

  • Alternate Memory Width:

    8

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

CY62167ELL-45ZXIT Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN201908-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The CY62167ELL-45ZXIT requires a specific power-up and power-down sequencing to prevent latch-up and ensure proper operation. Infineon recommends following the power-up and power-down sequencing guidelines outlined in their application note AN201908-01.
  • The CY62167ELL-45ZXIT has a high power density, and proper thermal management is crucial to prevent overheating. Infineon recommends using a thermal pad, thermal vias, and a heat sink to dissipate heat effectively. The device's thermal resistance (RθJA) is specified in the datasheet.
  • A reliable reset circuit is essential to ensure proper device operation. Infineon recommends using a reset circuit with a capacitor and a resistor to filter out noise and ensure a clean reset signal. The reset circuit should be designed to meet the device's reset timing requirements specified in the datasheet.
  • The CY62167ELL-45ZXIT has built-in ESD protection, but additional external protection measures may be necessary to prevent damage from electrostatic discharge. Infineon recommends following the ESD protection guidelines outlined in their application note AN201908-01, including the use of ESD protection diodes and resistors.

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CY62167ELL-45ZXIT Overview

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