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CY7C1049G30-10VXIT - Infineon

Description: SRAM - Asynchronous Memory IC 4Mbit Parallel 10 ns 36-SOJ 2.2V ~ 3.6V -40°C ~ 85°C

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CY7C1049G30-10VXIT - Infineon PCB footprint - Other - Other - PG-SOJ-36-800_2026-4.4
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CY7C1049G30-10VXIT Details

  • Manufacturer Part Number:

    CY7C1049G30-10VXIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    10 ns

  • JESD-30 Code:

    R-PDSO-J36

  • JESD-609 Code:

    e3

  • Length:

    23.495 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOJ

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    3.7592 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    10.16 mm

CY7C1049G30-10VXIT Frequently Asked Questions (FAQs)

  • The CY7C1049G30-10VXIT has an industrial temperature range of -40°C to +85°C, making it suitable for a wide range of applications.
  • It's recommended to follow a slow power-up sequence (dV/dt < 10 mV/μs) to ensure proper initialization of the device. During power-down, ensure that the power supply is reduced to 0V before removing the input signals.
  • Use a 4-layer PCB with a solid ground plane, and place decoupling capacitors (e.g., 0.1 μF and 10 μF) close to the device's power pins. Follow Infineon's PCB layout guidelines for optimal performance.
  • The CY7C1049G30-10VXIT is not designed for radiation-intensive environments. If your application requires radiation hardness, consider using a different device or consult with Infineon's radiation-hardened product offerings.
  • Check for power supply noise, signal integrity issues, and ensure that the device is operated within its specified temperature and voltage ranges. Use a logic analyzer or oscilloscope to capture and analyze the signals. Consult Infineon's application notes and technical support for further assistance.

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CY7C1049G30-10VXIT Overview

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