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CY7C1061G-10ZSXI - Infineon

Description: SRAM Chip Async Single 5V 16M-bit 1M x 16 10ns 54-Pin TSOP-II Tray

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CY7C1061G-10ZSXI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 54-pin TSOP II+
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CY7C1061G-10ZSXI - Infineon  - 3D model - Small Outline Packages - 54-pin TSOP II+
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CY7C1061G-10ZSXI Details

  • Manufacturer Part Number:

    CY7C1061G-10ZSXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Access Time-Max:

    10 ns

  • JESD-30 Code:

    R-PDSO-G54

  • JESD-609 Code:

    e3

  • Length:

    22.415 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    54

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Width:

    10.16 mm

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CY7C1061G-10ZSXI Overview

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