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CY7C1061GE30-10ZXI - Infineon

Description: SRAM 16Mb Fast SRAM With ECC

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PCB Footprints
CY7C1061GE30-10ZXI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 48-pin TSOP I (18.4 × 12 × 1.2 mm)
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3D Models
CY7C1061GE30-10ZXI - Infineon  - 3D model - Small Outline Packages - 48-pin TSOP I (18.4 × 12 × 1.2 mm)
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CY7C1061GE30-10ZXI Details

  • Manufacturer Part Number:

    CY7C1061GE30-10ZXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    10 ns

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    12 mm

CY7C1061GE30-10ZXI Frequently Asked Questions (FAQs)

  • The CY7C1061GE30-10ZXI has an industrial temperature range of -40°C to +85°C, making it suitable for a wide range of applications.
  • The CY7C1061GE30-10ZXI has a self-refresh mode that can be enabled by asserting the SREF pin low. This mode reduces power consumption by stopping the clock and disabling the output buffers.
  • The CY7C1061GE30-10ZXI supports a maximum clock frequency of 133 MHz, making it suitable for high-speed applications.
  • The CY7C1061GE30-10ZXI has a built-in error detection and correction mechanism. During write operations, the device performs a cyclic redundancy check (CRC) to detect errors. If an error is detected, the device can be configured to retry the write operation or generate an interrupt to alert the system.
  • The CY7C1061GE30-10ZXI has a read latency of 3 clock cycles and a write latency of 2 clock cycles, making it suitable for applications that require fast data access.

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CY7C1061GE30-10ZXI Overview

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