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CY7C1370KVE33-167AXI - Infineon

Description: SRAM - Synchronous, SDR Memory IC 18Mbit Parallel 167 MHz 3.4 ns 100-TQFP (14x20)

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CY7C1370KVE33-167AXI - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-pin TQFP (14 × 20 × 1.4 mm)
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CY7C1370KVE33-167AXI - Infineon  - 3D model - Quad Flat Packages - 100-pin TQFP (14 × 20 × 1.4 mm)
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CY7C1370KVE33-167AXI Details

  • Manufacturer Part Number:

    CY7C1370KVE33-167AXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Access Time-Max:

    3.4 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX36

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

CY7C1370KVE33-167AXI Frequently Asked Questions (FAQs)

  • The CY7C1370KVE33-167AXI has an industrial temperature range of -40°C to +85°C, and a commercial temperature range of 0°C to +70°C.
  • To implement CDC, you need to use a synchronizer circuit or a FIFO-based CDC structure. The datasheet provides guidelines for CDC implementation, but you may need to consult application notes or seek expert advice for specific implementation details.
  • The recommended termination scheme for the DDR3 interface is ODT (On-Die Termination) with a 50-ohm impedance. You should also ensure that the PCB trace impedance is matched to the ODT impedance to minimize signal reflections.
  • The CY7C1370KVE33-167AXI is designed to operate with a 1.35V supply voltage. While it may be possible to operate the device at a different voltage, it is not recommended as it may affect the device's performance, power consumption, and reliability. Consult the datasheet and application notes for specific voltage tolerance information.
  • The datasheet provides guidelines for power-up and power-down sequencing. In general, you should ensure that the VDDQ and VDD supply voltages are applied simultaneously, and that the clock signal is stable before applying the chip select signal. Consult the datasheet and application notes for specific sequencing requirements.

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