CY7C1470BV25-200AXC - Infineon

CY7C1470BV25-200AXC Details

• Manufacturer Part Number:

  CY7C1470BV25-200AXC

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  6.6

• Access Time-Max:

  3 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• Clock Frequency-Max (fCLK):

  200 MHz

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PQFP-G100

• JESD-609 Code:

  e3

• Length:

  20 mm

• Memory Density:

  75497472 bit

• Memory IC Type:

  ZBT SRAM

• Memory Width:

  36

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  100

• Number of Words:

  2097152 words

• Number of Words Code:

  2000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  2MX36

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LQFP

• Package Equivalence Code:

  QFP100,.63X.87

• Package Shape:

  RECTANGULAR

• Package Style:

  FLATPACK, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.6 mm

• Standby Voltage-Min:

  2.38 V

• Supply Current-Max:

  0.45 mA

• Supply Voltage-Max (Vsup):

  2.625 V

• Supply Voltage-Min (Vsup):

  2.375 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  14 mm