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CY7C1520KV18-250BZXC - Infineon

Description: SRAM 72MB (2Mx36) 1.8v 250MHz DDR II SRAM

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PCB Footprints
CY7C1520KV18-250BZXC - Infineon PCB footprint - BGA - BGA - 165-ball FBGA (13 × 15 × 1.4 mm)
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CY7C1520KV18-250BZXC - Infineon  - 3D model - BGA - 165-ball FBGA (13 × 15 × 1.4 mm)
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CY7C1520KV18-250BZXC Details

  • Manufacturer Part Number:

    CY7C1520KV18-250BZXC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    0.45 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    250 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    75497472 bit

  • Memory IC Type:

    DDR SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    2MX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA165,11X15,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Standby Voltage-Min:

    1.7 V

  • Supply Current-Max:

    0.53 mA

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    13 mm

CY7C1520KV18-250BZXC Frequently Asked Questions (FAQs)

  • The CY7C1520KV18-250BZXC has an industrial temperature range of -40°C to +85°C, and a commercial temperature range of 0°C to +70°C.
  • To ensure data integrity, it is recommended to follow the power-up and power-down sequences outlined in the datasheet, and to use a voltage regulator to ensure a stable power supply. Additionally, consider using a power-on reset (POR) circuit to reset the device during power-up.
  • The recommended termination scheme for the DDR3 interface is to use a series resistor (Rs) of 22-33 ohms and a parallel terminator (Rt) of 50-60 ohms. This helps to reduce signal reflections and improve signal integrity.
  • To handle clock domain crossing, it is recommended to use a clock domain crossing circuit (CDC) or a synchronizer to transfer data between clock domains. This helps to prevent metastability and ensure data integrity.
  • The recommended layout and routing strategy for the DDR3 interface is to use a differential pair routing scheme, with a signal trace length of less than 10 inches and a signal trace width of 5-10 mils. Additionally, it is recommended to use a ground plane and to avoid crossing signal traces over each other.

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CY7C1520KV18-250BZXC Overview

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