CY7C25652KV18-500BZC - Infineon

CY7C25652KV18-500BZC Details

• Manufacturer Part Number:

  CY7C25652KV18-500BZC

• Part Life Cycle Code:

  Obsolete

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  0

• Access Time-Max:

  0.45 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• Clock Frequency-Max (fCLK):

  500 MHz

• I/O Type:

  SEPARATE

• JESD-30 Code:

  R-PBGA-B165

• JESD-609 Code:

  e0

• Length:

  15 mm

• Memory Density:

  75497472 bit

• Memory IC Type:

  QDR SRAM

• Memory Width:

  36

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  165

• Number of Words:

  2097152 words

• Number of Words Code:

  2000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  2MX36

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA165,11X15,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  235

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.4 mm

• Standby Current-Max:

  0.36 A

• Standby Voltage-Min:

  1.7 V

• Supply Current-Max:

  1.21 mA

• Supply Voltage-Max (Vsup):

  1.9 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  20

• Width:

  13 mm