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CY8C6247FDI-D02T - Infineon

Description: ARM Microcontrollers - MCU PSOC6 Dual Core M4 & M0+

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PCB Footprints
CY8C6247FDI-D02T - Infineon PCB footprint - Other - Other - 80-Ball WLCSP 3.676 × 3.190 × 0.467 mm
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3D Models
CY8C6247FDI-D02T - Infineon  - 3D model - Other - 80-Ball WLCSP 3.676 × 3.190 × 0.467 mm
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CY8C6247FDI-D02T Details

  • Manufacturer Part Number:

    CY8C6247FDI-D02T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    15

  • JESD-30 Code:

    R-PBGA-B80

  • Length:

    3.676 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    0.467 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Width:

    3.19 mm

  • uPs/uCs/Peripheral ICs Type:

    PROGRAMMABLE SoC

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