CY8C6336BZI-BLF03 - Infineon

CY8C6336BZI-BLF03 Details

• Manufacturer Part Number:

  CY8C6336BZI-BLF03

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  BGA-116

• HTS Code:

  8542.31.00.30

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  13

• JESD-30 Code:

  R-PBGA-B116

• JESD-609 Code:

  e1

• Length:

  6.4 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  116

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA116,10X12,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Seated Height-Max:

  0.7 mm

• Supply Voltage-Nom:

  1.1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Width:

  5.2 mm

• uPs/uCs/Peripheral ICs Type:

  PROGRAMMABLE RFSoC