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CYPD3177-24LQXQT - Infineon

Description: USB Interface IC USB Type-C port controller CYPD3177

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PCB Footprints
CYPD3177-24LQXQT - Infineon PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - PG-VQFN-24
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3D Models
CYPD3177-24LQXQT - Infineon  - 3D model - Quad Flat No-Lead - PG-VQFN-24
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CYPD3177-24LQXQT Details

  • Manufacturer Part Number:

    CYPD3177-24LQXQT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    9

  • Moisture Sensitivity Level:

    3

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

CYPD3177-24LQXQT Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN2151, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CYPD3177-24LQXQT is a USB-C controller that supports Power Delivery (PD) and can be configured using the I2C interface. Infineon provides a software development kit (SDK) and a configuration tool that allows developers to customize the device's behavior and configure it for specific PD applications.
  • The CYPD3177-24LQXQT has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal pads, and minimizing thermal resistance. Infineon provides thermal management guidelines in their application note AN2151.
  • Infineon provides a troubleshooting guide in their application note AN2151, which covers common issues and their solutions. Additionally, developers can use the device's built-in diagnostic features, such as the I2C interface, to debug and troubleshoot issues.
  • The CYPD3177-24LQXQT has built-in electrostatic discharge (ESD) protection, but it's still essential to follow proper ESD handling and protection practices during manufacturing, assembly, and testing to prevent damage to the device.

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CYPD3177-24LQXQT Overview

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