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CYT2B93CACQ0AZSGS - Infineon

Description: ARM® Cortex®-M0+, ARM® Cortex®-M4F Traveo™ T2G Microcontroller IC 32-Bit Dual-Core 100MHz, 160MHz 2.0625MB (2.0625M x 8) FLASH 64-LQFP (10x10)

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CYT2B93CACQ0AZSGS - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-LQFP
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CYT2B93CACQ0AZSGS - Infineon  - 3D model - Quad Flat Packages - 64-LQFP
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CYT2B93CACQ0AZSGS Details

  • Manufacturer Part Number:

    CYT2B93CACQ0AZSGS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    17

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4F

  • Clock Frequency-Max:

    80 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    140

  • Number of External Interrupts:

    49

  • Number of I/O Lines:

    49

  • Number of Serial I/Os:

    21

  • Number of Terminals:

    64

  • Number of Timers:

    85

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    262144

  • ROM (words):

    2162688

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    160 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

CYT2B93CACQ0AZSGS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • Operating the device at the maximum junction temperature can reduce its lifespan. It is recommended to operate the device at a temperature at least 10°C below the maximum rating to ensure reliable operation.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow the recommended PCB layout guidelines for ESD protection.
  • Use a reflow soldering process with a peak temperature of 260°C and a dwell time of 30-60 seconds. Ensure that the device is handled and stored in a moisture-controlled environment to prevent moisture absorption.

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