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CYT2B95CACQ0AZSGS - Infineon

Description: ARM Microcontrollers - MCU Auto MCU

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CYT2B95CACQ0AZSGS - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-LQFP
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CYT2B95CACQ0AZSGS - Infineon  - 3D model - Quad Flat Packages - 100-LQFP
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CYT2B95CACQ0AZSGS Details

  • Manufacturer Part Number:

    CYT2B95CACQ0AZSGS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    17

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4F

  • Clock Frequency-Max:

    80 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    140

  • Number of External Interrupts:

    78

  • Number of I/O Lines:

    78

  • Number of Serial I/Os:

    29

  • Number of Terminals:

    100

  • Number of Timers:

    85

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    262144

  • ROM (words):

    2162688

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    160 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

CYT2B95CACQ0AZSGS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.
  • The recommended soldering conditions are: peak temperature 260°C, time above 217°C 60s, and time above 183°C 150s. Use a solder with a melting point above 217°C.
  • Store the device in a dry, cool place away from direct sunlight. Use anti-static packaging and handling procedures to prevent electrostatic discharge damage.
  • Use a low-inductance, low-resistance connection to the device pins. Ensure that the PCB layout minimizes electromagnetic interference and provides a solid ground plane.

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